Photonic-Integrated-Circuit Spectrometer
Navy STTR 2019.A - Topic N19A-T023 ONR - Mr. Steve Sullivan - [email protected] Opens: January 8, 2019 - Closes: February 6, 2019 (8:00 PM ET)
TECHNOLOGY AREA(S):
Chemical/Biological Defense, Sensors ACQUISITION PROGRAM:
EMW-FY14-01, Compact Wide Area Reconnaissance and Spectral Sensor OBJECTIVE: Develop a
fully-packaged short-wave infrared (SWIR, 900-1600 nm) spectrometer that uses
photonic integrated circuit (PIC) technology and meets these requirements:�
compact (handheld, < 0.5 kg), compatible with a single-mode optical source,
broadband (>200 nm, >128 channels), precise (<1 nm resol.), efficient,
and fabricated using a PIC foundry. DESCRIPTION: PICs are
emerging as low-cost replacements for fiber-optic systems that use many
individual fiber components, as well as a number of bulk optical systems. The
DoD is developing sensors based on Raman, fluorescence, and absorption
spectroscopies for areas such as chemical warfare agent detection, in situ
warfighter health analysis, and environmental monitoring. However, the critical
part of PIC spectroscopy, the spectrometer, does not currently meet the needs
of DoD spectroscopic sensors. Successful demonstrations of critical PIC
components, such as arrayed waveguide gratings (AWGs), detectors, or edge
couplers have not been integrated into a single fully-packaged SWIR
spectrometer using a PIC foundry. A suitable PIC will have: total package size
(target: < 100 cm3); PIC area (target: < 4 cm2); and efficiency (target:
> 10% quantum efficiency). Such a PIC spectrometer could then be integrated
with PIC transducers and on-chip sources for a fully integrated biological or
chemical detector. PHASE I: Design and analyze a
proposed approach for a PIC-based SWIR spectrometer based on a center
wavelength between 1150 nm and 1250 nm. Important design criteria are optical
bandwidth (target: > 200nm); channels (target: >128); channel-to-channel
extinction ratio (target: >30 dB); operation temperature (target: -10 deg
C); resolution (target: < 1.5 nm full width at half maximum or FWHM).
Demonstrate feasibility of the concept with S-parameter circuit (or equivalent)
analysis based on Process Design Kit (PDK) component and/or custom component
specifications for a specific PIC foundry. Ensure that the proposed device uses
single-mode waveguide as optical input. Electronic detection can be done either
with on-chip photodetectors (�active� PIC) with appropriate complementary
metal-oxide-semiconductor (CMOS) backplane for readout, or with off-chip
detection (�passive� PIC) with detector array optically coupled to PIC. Develop
a Phase II plan. PHASE II: Fabricate,
assemble, package, and test the proposed approach described in Phase I. Final
packaging should be clearly described and should include fiber-coupling to
input waveguide for optical testing. Test the prototype first with a polarized
white light source coupled to a single-mode optical fiber; and second with a
polarized pump at 1064 nm co-propagating with simulated (or real) Raman signal
approximately 10^8 times weaker, also in a single-mode optical fiber. Evaluate
the prototype against the criteria listed in the Phase I description. If the
prototype fails to meet the targets listed above, perform a root cause analysis,
and describe/report design trade-offs necessary to reach all of the performance
targets. Analyze the prototype design and packaging to determine additional
engineering steps required to achieve (i) lower temperature operation
(dual-stage thermoelectric cooler (TEC) down to -40 deg C); (ii) wider
wavelength range (target 400 nm) and/or a center wavelength near 950 nm
(instead of ~1200 nm); (iii) more output channels (512 channels); (iv) and
lower resolution (< 0.25 nm). Describe a realistic path for the integration
of this component into the component library PDK for a PIC foundry, and provide
realistic estimates of the total cost to manufacture this component. PHASE III DUAL USE
APPLICATIONS: Integrate a PIC spectrometer with a PIC laser source and a PIC
transducer for chemical or biological agent detection to create a chip-scale
detection system that can be deployed to virtually every warfighter or unmanned
detection platform in the DoD. This deployment can be done with the assistance
of the contractor via the design of the full PIC system, the submission of the
design to the PIC foundry, and the test and evaluation of the manufactured
system. REFERENCES: 1. Subramanian, A.Z. et al.
�Silicon and silicon nitride photonic circuits for spectroscopic sensing
on-a-chip.� Photonics Research 3, October 2015, B47-59. doi:
10.1364/PRJ.3.000B47 2. Wang, R. et al.
�III-V-on-silicon photonic integrated circuits for spectroscopic sensing in the
2-4 um wavelength range.� Sensors 17, 1788 (2017). doi: 10.3390/s17081788 3. Stievater, T.H. et al.
�Chemical sensors fabricated by a photonic integrated circuit foundry.� SPIE
10510, 1051001 (2018). doi: 10.1117/12.2294059 KEYWORDS: Photonic Integrated
Circuit; Spectrometer; Spectroscopy; Infrared; Foundry; Detector
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