|
Novel Thermal Management Materials Technologies for High Power Naval Systems
Navy SBIR 2018.1 - Topic N181-078 ONR - Ms. Lore-Anne Ponirakis - [email protected] Opens: January 8, 2018 - Closes: February 7, 2018 (8:00 PM ET)
TECHNOLOGY AREA(S):
Electronics, Materials/Processes ACQUISITION PROGRAM: NAVSEA
07, PMS-320, PEO Ships, PEO Carriers OBJECTIVE: To develop
advanced electrically insulating materials for improved passive thermal
management of high-power electronics.� The goal is to have materials that will
improve both performance and efficiency, lengthen lifetime, and reduce
lifecycle costs with enhanced thermal conductivity while remaining electrically
insulating. Advanced materials that can lower junction temperatures within
individual components, and those that serve as adhesives, pastes, underfills,
and top side coating for attaching components into systems or covering
components is the area of interest. DESCRIPTION: As circuits
become smaller and denser, performance, efficiency, and lifetime of high-power
electronics increasingly depends on rapid conduction of heat away from
semiconductor junctions in the components.� Without better ways for heat to
escape, higher junction temperatures dramatically reduce performance of
critical equipment, stress any system batteries, diminish efficiency and
lifetime, and increase lifecycle maintenance and replacement costs.�
Navy-relevant electronic components include power conversion devices such as
diodes and transistors used in almost every power supply, power converter, and
many alternating current/direct current (AC/DC) components, used in combat
systems, sensors on land and at sea, and components in high-temperature
environments. Radio frequency (RF) systems used in radar, communications, and
even Wi-Fi, all rely on RF diodes and transistors that are frequently pushed to
their maximum performance limit, generating performance-degrading heat.� The
current state-of-the-art for insulators is dielectric material typically made
from polymers or rubber, which can catch fire easily and degrade over time.�
Currently, polymers composited with materials such as boron nitride and diamond
powders are often used.� The research proposed should be to expand on the types
of materials being composited with the polymers to including but not limited to
materials such as boron nitride nanotubes, boron nitride nanosheets, boron
carbide powders, and aluminum nitride to achieve cost-effective and
manufacturable processes with enhanced thermal conductivity while remaining
electrically insulating.�� Successfully cooling of components and systems
requires both electrically insulating and electrically conductive passive heat
transport.� The focus for the proposed research is on the electrically
insulating materials. PHASE I: Develop samples of
material that demonstrate enhanced thermal conductivity for one or more
applications of electrically insulating materials appropriate for high-power
electronics in areas such as within individual components, and those that serve
as adhesives, pastes, underfills, and top-side coatings for attaching
components into systems or covering components.� The desired gap between the
component and the board for paste application is within the thickness range of
50-1000 microns.� The thermal sheet size should be approximately 6-8 cm^2, and
the thickness goal is 1000 microns.� The desired thermal conductivity for
thermal pastes, adhesives, and pads is >8 W/mK.� For topside thermal
coatings and electronic component inner layers, the desired thermal
conductivity is >2 W/mK. �The performer should test the performance of these
materials with commercially available testing equipment or equivalent in-house
testing apparatus.� Measurements up to one hundredth of a degree Celsius using
Infrared thermography can be used to test thermal conductivity.� Other
equivalent methods are acceptable.� The desired threshold requirement for this
topic is 10 W/mK.� The offeror will investigate and recommend the appropriate
manufacturing process, provided it yields high-quality materials at low cost
with the desired properties.� Proposals that include thermal sheets must be
designed to have the correct thickness and contact resistance, depending on the
application.� Proposals that include a coating that cannot be applied to all of
the items listed above, such as a paste, are acceptable.� Phase I will include
the creation of prototype plans to be developed in Phase II. PHASE II: Fabricate prototype
components or assemblages of components that demonstrate the improved thermal
performance such as within individual components, and those that serve as
adhesives, pastes, underfills, and top side coating for attaching components
into systems or covering components.� The offeror will quantify vibration,
thermal expansion, volumetric expansion, density change, and shrinkage, and
these results will be compared to known industry standards.� The prototype
components must simulate the thermal properties of actual components, such as
polymers, used for insulating laser diodes.� The performer should test the performance
of these components or assemblages of components.� Performance will be measured
relative to current performance parameters for junction materials. PHASE III DUAL USE
APPLICATIONS: Deliver field testable systems to the Navy of components or
assemblages of components and demonstrate that manufacturable processes are
available for cost-effective deployment of systems at scale.� Cost
effectiveness will be evaluated relative to the cost of the current
state-of-the-art. REFERENCES: 1. Hingyi Huang, Pingkai
Jiang, Toshikatsu, �A review of dielectric polymer composites with high thermal
conductivity,� IEEE Electrical Insulation Magazine (27), July-August 2011, DOI:
10.1109/MEI.2011.5954064 2. Hongli Zhu, Yuanyuan Li,
Zhiqiang Fang, Jiajun Xu, Fangyu Cao, Jiayu Wan, Colin Preston,Bao Yang, and
Liangbing Hu, "Highly Thermally Conductive Papers with Percolative Layered
Boron Nitride Nanosheets", ACS Nano, 2014 3. Han, Z. and Fina, A.
�Thermal Conductivity of Carbon Nanotubes and Their Polymer Nanocomposites: A
Review.� Prog. Polym. Sci. 2011, 36, 914�944 4. Chen, S., FitzGerald, J.,
Williams, J. and Bulcock, S. �Synthesis of Boron Nitride Nanotubes at Low
Temperatures Using Reactive Ball Milling�, Chemical Physical Letters, Vol. 299,
Issues 3- 4, January 11, 1999, Pages 260-264. KEYWORDS: High Power
Electronics; Thermally Conductive Electrically Insulating Composites;
Adhesives; Underfills; Top Side Coatings
|